Laser Beam Analysis | 雷射光圈分析
Laser Beam Analysis technology is used to measure the attributes of a laser beam in order to test its usefulness or compatibility for different laser applications. Laser Beam Analysis includes devices such as profiler systems that evaluate data from beam images to provide information such as beam location, peak intensity position, stability, or beam density. Laser Beam Analysis systems offer a range of information as well as a greater amount of control over many laser applications by delivering detailed information about a tested laser.
Haas Laser Technologies BWA-CAM M² 分析相機
- 可即時分析光束輪廓、M²、質心位置、圓度與像散
- 相容連續波(CW)雷射及具備單脈衝能力的脈衝雷射。
- 非常適合用於雷射研發、品質控制及光學系統監測
- 符合ISO 11146 和 ISO 13694標準
Haas Laser Technologies BA-CAM 光束分析相機
- 可即時分析光束輪廓、質心、橢圓度、削波水平、平坦度因子、平台均勻性
- 支援連續波(CW)和脈衝雷射源
- 適用於雷射系統診斷及製程優化
- 符合 ISO 13694 空間光束指標要求
Coherent® Lasercam™ 光束輪廓儀
- 12 and 14-bit Digital USB 2.0 Interface Options
- 具有高敏感度與動態範圍
- 包含直觀的 BeamView™ 軟體
CamUV 200nm UVUSB 3.1 相機
New- 該系列相機是多種UV成像應用的理想解決方案。
- 可提供 200nm 的設計
- 磷鍍膜相機傳感器
- 包括相機、傳輸線和便捷操作的軟體
- 提供NIR型版本
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